Staff Writer, CNET News.com
December 5, 2002, 10:32 AM PT
The strains of creating faster processors will get an airing among chipmakers next week.
Researchers and design engineers from IBM and Intel will present papers at the International Electron Devices Meeting (IEDM) next week that detail their work on "strained silicon," a manufacturing technique that promises to boost processor performance by up to 20 percent.
The San Francisco convention, one of the principal events for semiconductor designers, will feature a keynote speech by Intel Chairman Andy Grove as well as presentations from Sony, Samsung, Pennsylvania State University and the Massachusetts Institute of Technology, among others...