By David Lammers
EE Times
November 26, 2002 (6:13 p.m. EST)
EAST FISHKILL, N.Y. — IBM Corp. and Chartered Semiconductor Manufacturing Pte. have signed a joint development and manufacturing agreement that will result in a common process platform starting at the 90-nanometer node. The agreement will give each partner a second manufacturing source for parts produced on 300-mm wafers...